 Hong Seok Choi
| Title | Assistant Professor |
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| Institution | Clemson University |
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| Department | Department of Mechanical Engineering |
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| Address | 100 Fluor Daniel
Clemson, South Carolina 29634
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| vCard | Download vCard |
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 Bibliographic
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Maassen KF, Brown JS, Choi H, Thompson LL, Bostwick JB. Acoustic analysis of ultrasonic assisted soldering for enhanced adhesion. Ultrasonics. 2020 Feb; 101:106003. PMID: 31557648.
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